OCBC Student Awards For Undergraduates At Swinburne University in Malaysia 2019

OCBC Student Awards For Undergraduates At Swinburne University in Malaysia 2019

The Swinburne University, Malaysia invites applications from Individuals who are seeking to pursue a degree program at the Institution.

This award will provide the RM23,000 per year which will be tenable for the minimum period required to complete a course leading to a first degree – subject to consistent and excellent academic performance.

Eligible Countries: Malaysian citizens

Type: Undergraduate

Eligible Field Of Study: Accountancy and Finance / Economics / Business Administration, Computer Science and Information Technology, Mathematics and Statistics / Actuarial Science, Engineering.


  • Applicants must be Malaysian Students
  • Applicant must hold leadership positions in extra-curricular activities, societies and clubs in school/university, Possesses a dynamic personality with excellent communication and critical thinking skills and their Family household income should be below RM 5,000 monthly.
  • Applicants must be proficient in English Language
  • Applicants must have obtained minimum 7As in sijil pelajaran Malaysia (SPM) or 5As in unified examination certificate (UEC), minimum cumulative grade point average (CGPA) of 3.50 in matriculation/foundation studies and minimum CGPA of 3.50 for existing first-year undergraduates.

How To Apply: Interested applicants are advised to take the following steps;

  1. Complete the application form that can be downloaded at:
  2. Prepare an essay of 800 words on the topic below:

“Have you been in leadership positions in school/university? If yes, what are the biggest challenges you have faced and what have you learned from it?”

  1. Ensure all documents required are submitted along. You can download the scholarship checklist:

Please send in completed application form, essay and supporting documents to the address below:

OCBC Public Scholarship MALAYSIA
Talent Management
Human Resources
OCBC Bank (Malaysia) Berhad
5th Floor, Wisma Lee Rubber, 1 Jalan Melaka, 50100 Kuala Lumpur

For enquiries, please email:

*Only shortlisted candidates will be invited to an interview session.

Visit The Official Website For More Information

Scholarship Application Deadline: June 30, 2019

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